職缺條件

工作地

台灣 （新竹科學園區）

薪資待遇

面議（經常性薪資達4萬元或以上）

工作職責

1. Process integration of HK/MG and strain-Si process and its derivative devices
2. Relevant process documentation, including PDK, process route, and spec definition etc
3. Failure analysis, FMEA, and Pareto-chart. Plan the process improvement accordingly
4. Embedded NVM / RF / HV solutions of 28nm or beyond technology
5. Improve process Cp/Cpk to industry and automotive grades
6. PCM-key design and co-work with Fab for in-line monitoring management