PP25022800002 (02)【2025新幹班】半導體/IC設計類Semiconductor/IC Design

職缺條件

大學(含)以上
1.熟悉先進封裝製程技術，包括但不限於製程開發、封裝材料選擇及可靠性測試等
Proficient in advanced packaging processes, including process development, material selection, and reliability testing.
2.電機/電子、資工/資管、機械/應力、工工/工管、光電/物理、材料/化工、數學/統計等相關背景者尤佳
Backgrounds in Electrical Engineering, Information Management, Mechanical Engineering, Industrial Engineering, Optics & Physics, Materials Engineering or Mathematics & Statistics are highly preferred.

工作地

其他 （台北Taipei/新竹Hsinchu/台中Taichung）

薪資待遇

面議（經常性薪資達4萬元或以上）

工作職責

1.負責半導體IC設計、先進封裝技術、CMP製程整合、品質管理
Responsible for semiconductor IC design, advanced packaging, CMP integration, and quality management.
2.產品領域為消費性電子等
Focus on consumer electronics products.
3.工作地點為台北/新竹/台中
The job is based in Taipei, Hsinchu or Taichung.
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