PP22060600010 【S事業群半導體製程】Module Engineer

職缺條件

大學(含)以上

工作地

台灣 (新竹科學園區)

薪資待遇

面議(經常性薪資達4萬元或以上)

工作職責

1. Recipe tuning, process window improvement for HK/MG, strain-Si and other process modules.
2. Sustain productivity KPI and make continuous improvements to enhance the performance
3. Understand FMEA and able to generate FMEA analysis for new process steps. Able to utilize it to identify process window and derive the top 3 to 5 risk factors
4. Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning
5. Design process monitor keys and implemented in process flow
6. Experience in design of experiment (DOE) desirable.